Reinforced Structure Solder Pasteis uniformly blended from proprietary Solder Flux Paste, Alloy powder and nano metal powder. Dispersion strengthening by micro/nano second-phase particles improves the thermodynamic and mechanical properties of solder joints. Reinforced Structure Solder Pastemeets EU RoHS 2.0 and halogen-free requirements and supports no-clean processes.

Solder paste blends fine spherical solder alloy powder with specialized flux - like a strong adhesive between components. From tiny chips to complex PCBs, excellent printability and reliable soldering build precise micron-scale electrical connections for efficient production. Whether for SMT processes or environmentally stringent Lead-free production, our Solder Paste delivers excellent quality across diverse scenarios and builds a solid foundation for reliable electronic product performance. Every Solder Paste application is a perfect blend of technology and craftsmanship, unlocking unlimited possibilities for electronic innovation. Recommended customer Solder Paste selection follows the "Alloy Composition-Process-Flux Type-Cleaning Method-Halogen-Particle Size" approach to essentially lock in customer requirements.

Jetting Solder Paste is a no-clean paste with stable continuous jet printing for electronic components, connectors and ICs - no stringing, no satellite dots.