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Chongqing Qunwin Electronic Materials Co. Ltd.focuses on high-end electronic packaging materials and deeply engages in R&D and intelligent manufacturing of precision Tin-Based solders. The company was founded in 2007 and is located in the Chongqing Fuling National Economic and Technological Development Zone, with 19 years of deep engagement in electronic soldering, It is a technology enterprise integrating R&D, production, sales and service, Main products include BGA Solder Ball, CCGA Solder Column, Solder Paste, Copper Core Solder Ball, Nano Ag Solder Paste, Solder Flux Paste, Liquid Metal and other advanced packaging materials, It is a Tin-Based solder manufacturer with meaningful scale and a relatively rich product portfolio. With three production bases in Chongqing and a Shenzhen branch totaling about 7,000 m², it has built a multi-site collaborative supply network covering China. The company has been recognized as a National High-tech Enterprise and a national SRCI "Little Giant" enterprise, It is a Chongqing municipal SRCI SME and a technology-based SME, and holds a Chongqing Enterprise Technology Center, It has been listed in Chongqing's hard-tech SME support pool, and is a backbone enterprise with strong technical strength and core competitiveness in domestic high-end electronic packaging Tin-Based materials.
Exhibition: The 27th China International Optoelectronic Exposition (CIOE2026) ⏰ Dates: Sep 9-11, 2026 📍 Venue: Shenzhen World Exhibition & Convention Center (Bao'an) 🎯 Booth: 6C113 / 6C115
View DetailsIn chip thermal management, TIM1, TIM1.5 and TIM2 are often confused; choosing the wrong material can cause cooling failure or device damage. The core difference is mounting location, which drives performance needs and material selection. This guide expla
View DetailsIn advanced packaging, a Solder Ball only tens to hundreds of microns in Diameter not only provides electrical interconnect and mechanical support, but may also introduce an invisible reliability risk - alpha particles. These alpha particles mainly come f
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