Low-temperature tin-based solder includes LT solder ball, LT solder paste, LT solid-core solder wires and LT rosin-cored solder wire.Taking LT Sn-Bi solder paste as an example, its soldering process is compatible with standard electronic assembly technology using Surface Mount Technology (SMT). In comparison, the operating temperature of LT Sn-Bi solder paste is 70°C lower than that of conventional tin-based solder, only reaching 180°C. As the soldering temperature of LT Sn-Bi solder paste drops from 250°C to 180°C, thermal stress generated during soldering is reduced, which effectively lowers the warpage rate of printed circuit boards.

Solder Ball features high sphericity and tight dimensional tolerance. The product line covers multiple alloys and diameters to meet mainstream advanced semiconductor packaging needs. Diameter range: 30-2000 μm, with custom specifications available.

Solder Ball features high sphericity and tight dimensional tolerance. The product line covers multiple alloys and diameters to meet mainstream advanced semiconductor packaging needs. Diameter range: 30-2000 μm, with custom specifications available.