Indium is a metal material with extremely high heat-dissipation performance, By embossing textured patterns on indium-based Alloy sheets to fill interfacial gaps, while leveraging the high Thermal Conductivity of indium-based Alloy, to reduce interfacial thermal resistance. Indium-based thermal pads are soft metal pads, If both contact surfaces apply sufficient pressure (40-100PSI), the indium-based thermal pad can be firmly clamped in between, to achieve better heat-dissipation performance. QW-IA-TF01 Indium Sheet is a high-performance TIM for high-power chips and high heat-flux devices. Thermal conductivity up to 81 W/(m-K), far above traditional grease, with excellent wetting, ductility and stability to fill gaps and cut contact resistance - for CPU/GPU, liquid cooling and more.IGBT modules, power batteries, cryogenic cooling and more.