Kovar column is precisely manufactured from an iron-nickel-cobalt alloy material. Its thermal expansion coefficient (CTE) is highly compatible with that of alumina, aluminum nitride ceramics, and borosilicate glass. This product is specifically designed for high-reliability gas sealing processes, aiming to effectively alleviate the long-term dimensional drift caused by thermal mismatch of different materials, and to provide a durable and stable physical and chemical protective barrier for internal sensitive electronic components.

Column with copper wire braided is precisely formed by braiding multiple strands of high-purity copper wires, creating an interconnection structure with macroscopic flexibility. This product utilizes the micro-sliding and overall deformation capabilities among the multiple copper wires to achieve gradient dispersion and uniform release of stress, providing an effective solution to the thermal-mechanical mismatch problem between large-sized ceramic packages and organic substrates.

Micro Coil Spring (MCS) features a unique precision helical spring structure wound from elastic metal wire. It is an interconnection component engineered for extreme dynamic environments. Depend on its elastic deformation capability, it acts as a "mechanical filter". Under high-frequency vibration and severe shock conditions, it absorbs and dissipates mechanical stress to protect the primary solder joints from fatigue damage.

Copper column interconnection solution adopts high-purity copper as the substrate, with optional gold or tin plating on the surface, to fully leverage the excellent electrical and thermal conductivity of copper materials. Developed specifically for advanced packaging scenarios with stringent requirements on electrical performance and thermal management, this product delivers reliable interconnection assurance for high-performance chips through low interconnection resistance and efficient heat dissipation paths.

Column with copper wrap adopts high-lead solder column as rigid core, with thin copper tape precisely wound externally to form a composite structure. This design ingeniously combines the soldering wettability of high-lead material and the ductility of copper, creating an interconnection form with both rigidity and flexibility. It is specially developed to mitigate thermal expansion mismatch between ceramic packages and organic printed boards.

Conventional solder column is manufactured with mature high-lead alloy materials. Depend on their excellent wettability and solderability, they deliver cost-effective and high-efficiency interconnection solutions for standard ceramic packaging. Featuring mature processes and stable quality, this product satisfies general application requirements while balancing cost efficiency and mass delivery capacity.

Solder column is widely used in aerospace, military and large servers, which can solve the problem of thermal expansion coefficient mismatch in the packaging of large ceramic chips and improve the reliability of welding spot.