Copper Column
Introduction:
Copper column interconnection solution adopts high-purity copper as the substrate, with optional gold or tin plating on the surface, to fully leverage the excellent electrical and thermal conductivity of copper materials. Developed specifically for advanced packaging scenarios with stringent requirements on electrical performance and thermal management, this product delivers reliable interconnection assurance for high-performance chips through low interconnection resistance and efficient heat dissipation paths.
Specifications
Copper column interconnection solution adopts high-purity copper as the substrate, with optional gold or tin plating on the surface, to fully leverage the excellent electrical and thermal conductivity of copper materials. Developed specifically for advanced packaging scenarios with stringent requirements on electrical performance and thermal management, this product delivers reliable interconnection assurance for high-performance chips through low interconnection resistance and efficient heat dissipation paths.
Advantages
01
Excellent electrical and thermal conductivity
Ultra-low bulk resistivity and high Thermal Conductivity significantly cut interconnect loss, accelerate heat dissipation and control chip junction temperature.
02
Outstanding electromigration resistance
Strong copper metallurgical bonding delivers excellent electromigration resistance under fine-pitch, high-current-density conditions, extending interconnect life.
03
Supports high-density integration
Meets fine-pitch, high-density array interconnect needs and fits advanced packaging miniaturization trends.
04
Flexible surface plating options
Au plating offers excellent oxidation resistance and solderability for Au-Au thermocompression bonding; Sn plating is compatible with standard reflow at better cost.
