Column with Copper Wrap
Introduction:
Column with copper wrap adopts high-lead solder column as rigid core, with thin copper tape precisely wound externally to form a composite structure. This design ingeniously combines the soldering wettability of high-lead material and the ductility of copper, creating an interconnection form with both rigidity and flexibility. It is specially developed to mitigate thermal expansion mismatch between ceramic packages and organic printed boards.
Specifications
Column with copper wrap adopts high-lead solder column as rigid core, with thin copper tape precisely wound externally to form a composite structure. This design ingeniously combines the soldering wettability of high-lead material and the ductility of copper, creating an interconnection form with both rigidity and flexibility. It is specially developed to mitigate thermal expansion mismatch between ceramic packages and organic printed boards.
Advantages
01
Rigid-flexible composite design
A high-Pb core column provides Stable soldering support while the outer copper ribbon acts as a flexible stress buffer with controlled deformation in thermal cycling.
02
Efficient stress-buffering mechanism
The copper ribbon absorbs and disperses CTE-mismatch thermomechanical stress, significantly reducing shear strain at the joint.
03
Significantly improves thermal-cycling reliability
Optimized stress-relief paths greatly extend fatigue life under thermal cycling and improve board-level interconnect durability.
04
Strong process compatibility
Compatible with standard CCGA (ceramic column grid array) assembly for automated placement and reflow.
