Chongqing Qunwin Electronic Materials Co. Ltd. founded in 2007, is a National High-tech Enterprise specialized in R&D and production of electronic packaging materials.

       Chongqing Qunwin Electronic Materials Co. Ltd.focuses on high-end electronic packaging materials and deeply engages in R&D and intelligent manufacturing of precision Tin-Based solders. The company was founded in 2007 and is located in the Chongqing Fuling National Economic and Technological Development Zone, with 19 years of deep engagement in electronic soldering, It is a technology enterprise integrating R&D, production, sales and service, Main products include BGA Solder Ball, CCGA Solder Column, Solder Paste, Copper Core Solder Ball, Nano Ag Solder Paste, Solder Flux Paste, Liquid Metal and other advanced packaging materials, It is a Tin-Based solder manufacturer with meaningful scale and a relatively rich product portfolio.

       With three production bases in Chongqing and a Shenzhen branch totaling about 7,000 m², it has built a multi-site collaborative supply network covering China. The company has been recognized as a National High-tech Enterprise and a national SRCI "Little Giant" enterprise, It is a Chongqing municipal SRCI SME and a technology-based SME, and holds a Chongqing Enterprise Technology Center, It has been listed in Chongqing's hard-tech SME support pool, and is a backbone enterprise with strong technical strength and core competitiveness in domestic high-end electronic packaging Tin-Based materials.

       Technology-driven, independent innovation. After more than a decade of industry cultivation, through continuous technical breakthroughs and innovation iterations, the company has achieved stable mass production of ultra-fine Solder Ball from 30 μm to 100 μm, Independently developed products such as Copper Core Solder Ball, Micro-coil Spring, CCGA Solder Column and Nano Ag Solder Paste, effectively strengthen domestic independent supply of high-end electronic packaging materials and enrich the product portfolio. As of Sep 2026, the company holds 16 granted patents, including 7 invention patents and 9 utility model patents; Core products Solder Ball, Solder Column and Copper Core Solder Ball has been recognized as Chongqing high-tech products, and won two Third Prizes of the China Nonferrous Metals Industry Science and Technology Award (Solder Ball; copper ball and Solder Column). The company has also been honored as a "Chongqing IP Advantage Enterprise" and a "Chongqing municipal sci-tech innovation enterprise"

       Craftsmanship and excellent quality. The company has established standardized, refined and regulated production control and quality assurance systems, and has obtained ISO 9001 Quality Management System Certification, ISO 14001:2015 Environmental Management System Certification and IATF 16949 Automotive Quality Management System Certification, providing end-to-end systematic assurance for product quality. Leveraging mature processes, Stable product performance and strict quality standards, products widely serve the domestic high-end market and are exported to the United States, Europe, Vietnam and other countries and regions, winning high recognition and trust from customers at home and abroad with quality products and services.

       Looking ahead, the company will continue to focus on the high-end electronic packaging materials track, uphold the "SRCI (Specialized, Refined, Characteristic and Innovative)" development philosophy, taking technological innovation as the core driver and high-quality products as the foundation, continuously deepening Precision Electronic Packaging Materials. continuously optimizing the product portfolio, upgrading processes and consolidating technical advantages, fully empowering high-quality upgrading of semiconductors, precision electronics and advanced manufacturing, committed to building an industry-influential leading brand in high-end electronic packaging materials.