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Low-temperature Series
Introduction:
Low-temperature tin-based solder includes LT solder ball, LT solder paste, LT solid-core solder wires and LT rosin-cored solder wire.Taking LT Sn-Bi solder paste as an example, its soldering process is compatible with standard electronic assembly technology using Surface Mount Technology (SMT). In comparison, the operating temperature of LT Sn-Bi solder paste is 70°C lower than that of conventional tin-based solder, only reaching 180°C. As the soldering temperature of LT Sn-Bi solder paste drops from 250°C to 180°C, thermal stress generated during soldering is reduced, which effectively lowers the warpage rate of printed circuit boards.
Specifications
Low-temperature tin-based solder includes LT solder ball, LT solder paste, LT solid-core solder wires and LT rosin-cored solder wire.Taking LT Sn-Bi solder paste as an example, its soldering process is compatible with standard electronic assembly technology using Surface Mount Technology (SMT). In comparison, the operating temperature of LT Sn-Bi solder paste is 70°C lower than that of conventional tin-based solder, only reaching 180°C. As the soldering temperature of LT Sn-Bi solder paste drops from 250°C to 180°C, thermal stress generated during soldering is reduced, which effectively lowers the warpage rate of printed circuit boards.
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